Digital Image Correlation (DIC) is a 3D, full-field, non-contact optical technique to measure contour, deformation vibration and strain on almost any material. It can be used for many tests including tensile, torsion, bending and combined loading for both static and dynamics applications. The technique can be applied to small or large area testing and the results are readily comparable with FEA results or strain gauges.

Optical measurement solutions for strain & stress measurements, based on Electronic Speckle Pattern Interferometry (ESPI). Effective development of advanced materials and components requires an understanding of their behaviour under load at various conditions. Optical full-field measurement techniques are increasingly being used in material testing, fracture mechanics and vibration analysis.
The Dantec Dynamics ESPI Systems are designed for complete three dimensional, full field and highly sensitive displacement and strain and stress analysis. The measurement is performed non-contact on the whole measuring area on nearly any material and component.


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